Anritsu’s Microelectronics Fabrication Center Offers Performance, Quality and Flexibility
ince being formed in 1895, almost a decade
before the vacuum tube was invented, Anritsu has
earned an enviable reputation as a major supplier
of RF/microwave test equipment. Developing equipment
to make precision measurements from DC to terahertz
frequencies is not easy, often requiring unique designs and
manufacturing processes. To maintain leadership, Anritsu
has established its own hardware and software capabili-
ties, particularly for the microelectronics components
that comprise the broadband front-ends setting the
performance of the company’s instruments.
While the mantra for Anritsu’s microelectronics components is “performance, quality and flexibility,” the manufacturing volumes do not consume the company’s capacity,
which allows Anritsu to develop symbiotic relationships
with other companies needing the same advanced microelectronics design and manufacturing capabilities. The
Microelectronics Fabrication Center, part of Anritsu’s U.S.
operation, fabricates thin film circuits, MEMS structures,
GaAs and InP optoelectronics devices and offers machining, microelectronics assembly and testing services. The
microelectronics team is proud of the support it provides,
from process engineering to rapid prototyping—often developing a prototype in half the time quoted by other contract manufacturers. For production programs, Anritsu
can manage the supply chain for a product, simplifying the
procurement of a customer’s bill of materials.
Thin film circuits can be fabricated on a range of materials: alumina, aluminum nitride, fused silica, sapphire, glass
and chemical vapor deposition (CVD) diamond, as well as
silicon, GaAs and InP. Etching processes include reactive-ion etching, plasma and wet etching of metal, silicon, nitride and oxide. Sputtering, e-beam evaporation, selective
Au and AuSn electroplating are available for metal deposition, and plasma-enhanced CVD is used for dielectric layers. The thin film networks can incorporate polyimide, BCB
and silicon nitride capacitors; laser-trimmed resistors;
wrap-arounds and filled and plated-through vias. The facil-
ity also has the capability to align double-sided circuits.
The Microelectronics Fabrication Center has a complete
range of chip-and-wire assembly processes: epoxy and
eutectic die attach, ball bonding, manual and automated
wedge bonding, gap welding and tack bonding. Soldering
processes include AuSn, In, SnPb and AuGe, with RoHS-
compliant material options available. In-house scanning
electron and acoustic microscopy support process devel-
opment and quality assessment.
Not surprisingly, Anritsu’s suite of test capabilities is
unmatched, spanning DC to 145 GHz and encompassing
S-parameters, noise figure, phase noise, IP3, harmonics
and dynamic range. Anritsu also offers a full complement
of reliability testing to support development and production: IC thermal imaging, die attach void assessment, highly
accelerated life testing (HALT), highly accelerated stress
screening (HASS), burn in, temperature cycling, power
cycling, drop testing, shear and pull testing and EMC/EMI
Based in Morgan Hill, Calif., the Microelectronics Fabrication Center contains a 25,000 square foot RF/microwave assembly area, 8,000 square feet of class 100
and 10,000 clean room, a machining center and offices.
Anritsu’s capability is ISO9001/ISO17025 certified
and ITAR compliant. In addition to supporting Anritsu’s
own test equipment, the center manufactures products
for the telecommunications, automotive, civil aerospace,
defense, medical, biotechnology and solar industries. While
most of the center’s customers are within the U.S., several
The Microelectronics Fabrication Center lets customers
tap into Anritsu’s microelectronics technology, developed
over decades, and reap the same “performance, quality and
flexibility” found in Anritsu’s high performance test equipment.