stants and loss tangents. Material thicknesses from 20
to 1000 microns can be accommodated in the company’s non-destructive test fixture. Please contact RCL
today at 877-387-6125 for a free quote.
WEST•BOND Inc. Booth 208
Wedge Bonder/Ball Bonder
West•Bond offers wedge
bonder/ball bonder combination machines, as well as
die bonders that combines
both epoxy and eutectic
methods in one chassis.
Between these two series
you can bond most any product in the microelectronic
industry. Since 1966, West•Bond has been a design
and manufacturer of assembly and test equipment for
the microelectronic industry, including automatic,
semiautomatic and manual ESD protected bonders
with ultrasonic, thermosonic and thermocompression
ANSYS Booth 209
Electro-Thermal Design Flow
ANSYS will demonstrate its
new electro-thermal design flow developed to
design from layout, inclusion of signal integrity, power integrity, EMI, thermal
and structural reliability. As power density within digital electronics and microwave systems continues to
increase, the ability to accurately predict electro-thermal effects within a design becomes paramount. The
new design flow allows engineers to perform electromagnetic, thermal, stress, shock and vibration analysis
from a seamless integration of HFSS, SIwave, Icepak
and ANSYS Mechanical.
Gowanda Electronics Booth 210
Broadband Conicals to 5 A DC
Gowanda Electronics will
feature conical designs including the C550FL series
of high-current, thru-hole,
conical inductors providing
a current rating to 5 A DC.
As with Gowanda’s other conicals, this newest series
provides predictable frequency response and repeatable performance from 40 MHz to 40 GHz and is specifically designed for high frequency applications
where ultra-low insertion loss is a design requirement.
Gowanda Electronics, Dyco Electronics, Butler Winding, Communication Coil, TTE Filters, Microwave Circuits and Instec Filters are affiliates of GCG (Gowand-
achieves high efficiency operation with proven reliability. Like all Ophir RF amplifiers, the 5304050 comes
backed by Ophir RF’s commitment to total customer
Maury Microwave Booth 205
Measurement and Modeling Device
Exceptional companies have superior labs—complete
your lab with Maury Microwave! Maury, a leader in
measurement and modeling device characterization
solutions, VNA calibration accessories and interconnections, will be showcasing active and hybrid-active
harmonic load pull solutions, LXI™-certified mechanical impedance tuners, pulsed IV/RF compact transistor
modeling as well as coaxial and waveguide VNA calibration kits and metrology adapters, in-stock color-coded precision and daily-use adapters and test-port,
phase-stable and value cable assemblies. Visit us for
details, demos, deals and NPIs!
MCV Microwave Booth 206
Removable Connectors for Drop-In
MCV Microwave high frequency cavity and planar
filters for 5G system integration include very wide-band bandpass filter covering from 10 to 30 percent
bandwidth, having low insertion loss and moderate
rejection. MCV Microwave also offers extremely nar-row-band notch filters, as narrow as 0.3 percent bandwidth, having very sharp roll-off and high rejection.
Excellent ultimate rejection and good passband
matching or 14 dB return loss are achieved in both
surface mount and drop-in packages in a very small
footprint for X-, Ku- and Ka-Band.
RCL Microwave Inc. Booth 207
Non-Destructive Broadband Thin Film
RCL Microwave Inc. specializes in non-destructive
broadband thin film dielectric characterization. We use
the phase differential method to achieve a high degree of accuracy for a wide range of dielectric con-
Orbel Booth 117
Since 1961, Orbel’s custom
design and manufacturing
process has enabled
unique engineered solutions for a variety of applications and industries.
From conception through delivery, Orbel offers today’s
most effective EMI/RFI shielding, photo-etched precision metal parts, precision metal stampings and electroplated metal foils. Areas of specialization include
aerospace, telecommunications, electronics, medical,
automotive and manufacturing.
Ophir RF Inc. Booth 204
Solid State Broadband High-Power
The 5304050 is a 10 W
broadband amplifier that
covers the 6 to 18 GHz frequency range. This small
and lightweight amplifier
utilizes class AB linear GaN
devices that provide an excellent third order intercept
point, high gain and a wide dynamic range. Due to
robust engineering and employment of the most advanced devices and components, this amplifier
WES T·BOND INC. WES T·BOND INC.
WES T·BOND INC. WES T·BOND INC.